In the era of smart manufacturing, machine vision has become the standard solution for production line quality inspection. Yet the reality is: different products, defects and materials require completely distinct "vision sensors" and "intelligent algorithms"...

In the semiconductor manufacturing industry, yield is the lifeline. A 0.1-micron particle, a nanometer-level overlay offset, or an air bubble inside a BGA solder ball — these invisible "hidden killers" imperceptible to the naked eye may ruin an entire wafer worth tens of thousands of US dollars...

In the PCB manufacturing industry, a tiny defect can ruin an entire batch of circuit boards. Poor soldering, solder bridges, insufficient solder, short circuits, missing components, reversed polarity, no copper in drilled holes... Each type of defect can lead to functional failure of end products, or even safety incidents...