Products for Semiconductor Defect Inspection Applications

In the semiconductor manufacturing industry, yield is the lifeline.

A 0.1-micron particle, a nanometer-level overlay offset, or an air bubble inside a BGA solder ball — these invisible "hidden killers" imperceptible to the naked eye may ruin an entire wafer worth tens of thousands of US dollars.

As chip processes advance toward 3nm and more advanced nodes, the difficulty of defect inspection rises exponentially. Traditional Scanning Electron Microscopy (SEM) is time-consuming and labor-intensive, delivers poor performance in modern sub-nanometer defect detection, and comes with low economic benefits.

From wafer substrates, photolithography and etching to advanced packaging, mature AI vision and non-destructive testing solutions have long been available, building a full-process quality inspection defense line for chip manufacturing.

In this article, we sort out the core challenges of semiconductor defect inspection and help you identify the missing links in your product lineup.

LED High Uniformity Linear Light Series